Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17896746
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Filing Dt:
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08/08/2008
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Publication #:
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Pub Dt:
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02/29/2024
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Inventors:
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RAHUL AGARWAL, CHANDRA SEKHAR MANDALAPU, RAJA SWAMINATHAN
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Title:
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PARTITIONING WAFER PROCESSING AND HYBRID BONDING OF LAYERS FORMED ON DIFFERENT WAFERS FOR A SEMICONDUCTOR ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2485 AUGUSTINE DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| ADVANCED MICRO DEVICES, INC. C/O KLS |
| 797 SAM BASS ROAD #2559 |
| ROUND ROCK, 78681 UNITED STATES |
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