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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18387129
Filing Dt:
11/06/2023
Publication #:
20240072203
Pub Dt:
02/29/2024
Inventors:
Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Yoshinori Ogawa et al
Title:
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
Assignment: 1
Reel/Frame:
065581/0074Recorded: 11/16/2023Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHU, CHEN-FU
Exec Dt:
08/04/2020
CHAN, SHIH-KAI
Exec Dt:
08/04/2022
SHIH, YI-FENG
Exec Dt:
08/04/2020
DOAN, DAVID TRUNG
Exec Dt:
08/09/2020
DOAN, TRUNG TRI
Exec Dt:
08/04/2020
OGAWA, YOSHINORI
Exec Dt:
08/05/2020
OTAKE, KOHEI
Exec Dt:
08/05/2020
KONDO, KAZUNORI
Exec Dt:
08/04/2020
OHORI, KEIJI
Exec Dt:
08/05/2020
KITAGAWA, TAICHI
Exec Dt:
08/05/2020
MATSUMOTO, NOBUAKI
Exec Dt:
08/05/2020
OZAI, TOSHIYUKI
Exec Dt:
08/05/2020
UEDA, SHUHEI
Exec Dt:
08/05/2020
Assignees:
SEMILEDS CORPORATION
3F, NO. 11, KE JUNG RD., CHU-NAN SITE
HSINCHU SCIENCE PARK, MIAO-LI COUNTY
CHU-NAN, TAIWAN 350
SHIN-ETSU CHEMICAL CO., LTD.
20TH FLOOR (RECEPTION), MARUNOUCHI EIRAKU BLDG. 4-1,
MARUNOUCHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-0005
Correspondent:
STEPHEN GRATTON
2764 S BRAUN WAY
LAKEWOOD, CO 80228

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