Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18389517
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Filing Dt:
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11/14/2023
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Publication #:
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Pub Dt:
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03/07/2024
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Inventors:
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Jungrae Park, ZAVIER ZAI YEONG TAN, KARTHIK BALAKRISHNAN, JAMES S. PAPANU et al
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Title:
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LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1211 SW FIFTH AVENUE |
| SUITE 1900 |
| PORTLAND, OR 97204 |
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