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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18389506
Filing Dt:
11/14/2023
Publication #:
Pub Dt:
03/07/2024
Inventors:
Angela Kessler, Robert Carroll, Robert Fehler
Title:
Semiconductor Package and Passive Element with Interposer
Assignment: 1
Reel/Frame:
065561/0343Recorded: 11/14/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/17/2021
Exec Dt:
03/03/2021
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959
Assignment: 2
Reel/Frame:
065561/0381Recorded: 11/14/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/02/2021
Assignee:
101 PACIFIC COAST HIGHWAY,
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959

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