Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18184029
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Filing Dt:
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03/15/2023
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Publication #:
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Pub Dt:
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03/07/2024
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Inventors:
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HUN SEONG CHOI, WOOSEOK CHANG, JUNYEON LEE, MINKYU KIM, BYUNGWOO BANG, JIYE CHOI
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Title:
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STACKED INTEGRATED CIRCUIT (IC) PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 16677 |
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| NSIP LAW |
| P.O. BOX 65745 |
| WASHINGTON, DC 20035 |
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05/05/2024 02:27 AM
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