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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18466361
Filing Dt:
09/13/2023
Publication #:
Pub Dt:
03/14/2024
Inventors:
Hengky Eng, Kim Hai Wong, Zhongxi Huang
Title:
Injection Mold Insert and Method of Manufacturing the Same
Assignment: 1
Reel/Frame:
064891/0763Recorded: 09/13/2023Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/22/2023
Assignee:
UNIT LEVEL 5 AND 6, LEVEL 2, BUILDING 20
NO. 999 YINGLUN ROAD, PILOT FREE TRADE ZONE
SHANGHAI, CHINA
Correspondent:
BARLEY SNYDER
2 GREAT VALLEY PARKWAY
SUITE 110
MALVERN, PA 19355
Assignment: 2
Reel/Frame:
064891/0812Recorded: 09/13/2023Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/24/2023
Exec Dt:
08/22/2023
Assignee:
NO. 26 ANG MO KIO
INDUSTRIAL PART 2
SINGAPORE, SINGAPORE S 569507
Correspondent:
BARLEY SNYDER
2 GREAT VALLEY PARKWAY
SUITE 110
MALVERN, PA 19355

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