Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17944657
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Filing Dt:
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09/14/2022
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Publication #:
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Pub Dt:
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03/14/2024
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Inventors:
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Wee Aun Jason Lim, Marie Hazel Barozzo Gabrillo, Chai Chee Lee, Nor Haqimi Mohamed
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Title:
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MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX CURVED SURFACE ATTACHED TO A SEMICONDUCTOR DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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| MURPHY, BILAK & HOMILLER, PLLC/INFINEON |
| P.O. BOX 1959 |
| CARY, NC 27512-1959 |
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