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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18453639
Filing Dt:
08/22/2023
Publication #:
20240087995
Pub Dt:
03/14/2024
Inventors:
Ralf Otremba, Thai Kee Gan, Teck Sim Lee, Chwee Pang Tommy Khoo, Christian Schiele et al
Title:
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Assignment: 1
Reel/Frame:
064985/0413Recorded: 09/21/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SCHIELE, CHRISTIAN
Exec Dt:
08/21/2023
KHOO, CHWEE PANG TOMMY
Exec Dt:
08/25/2023
UNTERHOFER, KATRIN
Exec Dt:
09/01/2023
UREDAT, PATRICK
Exec Dt:
08/25/2023
OTREMBA, RALF
Exec Dt:
08/18/2023
LEE, TECK SIM
Exec Dt:
08/19/2023
GAN, THAI KEE
Exec Dt:
08/20/2023
Assignee:
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959
Assignment: 2
Reel/Frame:
065176/0468Recorded: 10/11/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INFINEON TECHNOLOGIES AG
Exec Dt:
10/11/2023
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2
VILLACH, AUSTRIA A-9500
Correspondent:
VANYA PEYCHEVA
AM CAMPEON 1-15
PATENT DEPARTMENT MUC/11.2.348
NEUBIBERG, 85579 GERMANY

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