Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18314287
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Filing Dt:
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05/09/2023
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Publication #:
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Pub Dt:
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03/14/2024
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Inventors:
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Hyojin Yun, Unbyoung Kang, Seokbong Park, Sechul Park, Junyoung Park, Teahwa Jeong et al
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Title:
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SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| MYERS BIGEL/CAREY GREGORY |
| 4140 PARKLAKE AVENUE, SUITE 600 |
| RALEIGH, NC 27612 |
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05/17/2024 05:42 PM
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