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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18519750
Filing Dt:
11/27/2023
Publication #:
Pub Dt:
03/21/2024
Inventors:
Takeshi YASUI, Katsunori FUNAKI, Yasutoshi TSUBOTA, Koichiro HARADA
Title:
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Assignment: 1
Reel/Frame:
065683/0893Recorded: 11/28/2023Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/20/2020
Exec Dt:
09/04/2020
Exec Dt:
09/04/2020
Exec Dt:
09/04/2020
Assignee:
3-4, KANDAKAJI-CHO, CHIYODA-KU
TOKYO, JAPAN 1010045
Correspondent:
EDELL, SHAPIRO & FINNAN, LLC
9801 WASHINGTONIAN BOULEVARD
SUITE 750
GAITHERSBURG, MD 20878

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