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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17932624
Filing Dt:
09/15/2022
Publication #:
20240096809
Pub Dt:
03/21/2024
Inventors:
Hiroki Tanaka, Robert Alan May, Onur Ozkan, Ali Lehaf, Steve Cho, Gang Duan, Jieping Zhang et al
Title:
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES
Assignment: 1
Reel/Frame:
061379/0244Recorded: 10/11/2022Pages: 13
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TANAKA, HIROKI
Exec Dt:
09/02/2022
MAY, ROBERT ALAN
Exec Dt:
09/12/2022
OZKAN, ONUR
Exec Dt:
09/20/2022
LEHAF, ALI
Exec Dt:
09/13/2022
CHO, STEVE
Exec Dt:
09/02/2022
DUAN, GANG
Exec Dt:
09/07/2022
ZHANG, JIEPING
Exec Dt:
09/02/2022
MANEPALLI, RAHUL N.
Exec Dt:
09/01/2022
MAHAJAN, RAVINDRANATH VITHAL
Exec Dt:
09/02/2022
AZIMI, HAMID
Exec Dt:
09/06/2022
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ALISHA FEUSTEL
4757 W PARK BLVD, STE 113-1026
AKONA IP
PLANO, TX 75093

Search Results as of: 05/17/2024 11:37 PM
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