Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18221510
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Filing Dt:
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07/13/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Inventors:
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Xianming CHEN, Yejie HONG, Gao HUANG, Benxia HUANG
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Title:
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CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FPC FACTORY, 3209 NORTH ZHUFENG AVENUE, DOUMEN, ZHUHAI, |
| GUANGDONG, CHINA 519175 |
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| THE PL LAW GROUP, PLLC |
| 13800 COPPERMINE ROAD |
| FL 1-3 |
| HERNDON, VA 20171 |
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05/14/2024 04:28 PM
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