Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18274564
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Filing Dt:
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07/27/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Inventors:
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Taihong XIA, Chao CHEN, Yanghua YU, Shuai YUAN
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Title:
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CAMERA MODULE, ASSEMBLY METHOD THEREFOR, AND ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE 3401, UNIT A, BUILDING 6, SHUM YIP SKY PARK |
| NO. 8089, HONGLI WEST ROAD, XIANGMIHU STREET, FUTIAN DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518040 |
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| WOMBLE BOND DICKINSON (US) LLP/HONOR DEV |
| ATTN: IP DOCKETING |
| P.O. BOX 570489 |
| ATLANTA, GA 30357-0037 |
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05/09/2024 02:39 AM
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