Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17768656
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Filing Dt:
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04/13/2022
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Publication #:
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Pub Dt:
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04/04/2024
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Inventors:
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Daeun SUNG, Tae Hoon KIM, Chun Ho PARK, Yong Hee AN, Wangrae JOE, Ho Hoon KIM et al
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Title:
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THERMOPLASTIC RESIN COMPOSITION AND EXTERIOR MATERIAL INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| COLLIN W. PARK |
| MORGAN, LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVE, NW |
| WASHINGTON, DC 20004 |
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06/04/2024 05:15 AM
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