Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18546467
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Filing Dt:
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08/15/2023
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Publication #:
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Pub Dt:
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04/04/2024
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Inventors:
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Fumiki Komagata, Hiroshi Itou, Ayana Tomioka
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Title:
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ELECTRONIC COMPONENT SEALING LID
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1-3, KYOBASHI, CHUO-KU |
| TOKYO, JAPAN 104-8335 |
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| WOOD HERRON & EVANS LLP |
| 600 VINE STREET |
| SUITE 2800 |
| CINCINNATI, OH 45202 |
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05/15/2024 12:06 PM
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