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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17957751
Filing Dt:
09/30/2022
Publication #:
20240113005
Pub Dt:
04/04/2024
Inventors:
Jeremy Ecton, Aleksandar Aleksov, Hiroki Tanaka, Brandon Marin, Srinivas Pietambaram et al
Title:
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES
Assignment: 1
Reel/Frame:
061306/0497Recorded: 10/04/2022Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ECTON, JEREMY
Exec Dt:
10/01/2022
ALEKSOV, ALEKSANDAR
Exec Dt:
09/27/2022
TANAKA, HIROKI
Exec Dt:
09/29/2022
MARIN, BRANDON
Exec Dt:
09/27/2022
PIETAMBARAM, SRINIVAS
Exec Dt:
09/27/2022
BRUN, XAVIER
Exec Dt:
09/29/2022
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ESSENTIAL PATENTS GROUP, LLP.
5 CENTERPOINTE DRIVE
SUITE 400
LAKE OSWEGO, OR 97035

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