Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18276854
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Filing Dt:
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08/10/2023
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Publication #:
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Pub Dt:
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04/11/2024
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Inventors:
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Hisashi SAKAI, Masahiko TAJIMA, Tadatomo MAEHARA, Masami YOSHIKAWA
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Title:
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SENSOR PACKAGE, SENSOR MODULE, AND SENSOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6 TAKEDA TOBADONO-CHO |
| FUSHIMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 612-8501 |
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| PROCOPIO / KYOCERA CORPORATION PROCOPIO, |
| 525 B STREET |
| SUITE 2200 |
| SAN DIEGO, CA 92101 |
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05/11/2024 11:02 PM
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