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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18543432
Filing Dt:
12/18/2023
Publication #:
20240120200
Pub Dt:
04/11/2024
Inventors:
Hsi-Wen Tien, Wei-Hao Liao, Pin-Ren Dai, Chih Wei Lu, Chung-Ju Lee
Title:
METHOD AND STRUCTURE OF CUT END WITH SELF-ALIGNED DOUBLE PATTERNING
Assignment: 1
Reel/Frame:
065898/0013Recorded: 12/18/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TIEN, HSI-WEN
Exec Dt:
10/01/2019
LIAO, WEI-HAO
Exec Dt:
10/01/2019
DAI, PIN-REN
Exec Dt:
10/01/2019
LU, CHIH WEI
Exec Dt:
10/01/2019
LEE, CHUNG-JU
Exec Dt:
10/01/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE LLP (24061) IP SECTION
2801 N. HARWOOD ST.
SUITE 2300
DALLAS, TX 75201
Assignment: 2
Reel/Frame:
065898/0179Recorded: 12/18/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TIEN, HSI-WEN
Exec Dt:
10/01/2019
LIAO, WEI-HAO
Exec Dt:
10/01/2019
DAI, PIN-REN
Exec Dt:
10/01/2019
LU, CHIH WEI
Exec Dt:
10/01/2019
LEE, CHUNG-JU
Exec Dt:
10/01/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE LLP (24061) IP SECTION
2801 N. HARWOOD ST.
SUITE 2300
DALLAS, TX 75201

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