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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18510887
Filing Dt:
11/16/2023
Publication #:
20240120216
Pub Dt:
04/11/2024
Inventors:
Hiroya SUGIMOTO, Ikuhisa MORIOKA, Keita MINE, Ryuji TAMURA, Natsuki HIRATA, Yohei KAJIURA
Title:
METHOD OF ADJUSTING HEAT UNIFORMITY ON WAFER MOUNT AND METHOD OF MANUFACTURING WAFER MOUNT
Assignment: 1
Reel/Frame:
065583/0232Recorded: 11/16/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SUGIMOTO, HIROYA
Exec Dt:
10/27/2023
MORIOKA, IKUHISA
Exec Dt:
10/30/2023
MINE, KEITA
Exec Dt:
10/27/2023
TAMURA, RYUJI
Exec Dt:
10/27/2023
HIRATA, NATSUKI
Exec Dt:
10/27/2023
KAJIURA, YOHEI
Exec Dt:
11/06/2023
Assignee:
NGK INSULATORS, LTD.
2-56, SUDA-CHO, MIZUHO-KU
NAGOYA-SHI, AICHI-PREFECTURE, JAPAN 467-8530
Correspondent:
STEPHEN P. BURR
BURR PATENT LAW, PLLC
P.O. BOX 869
FAYETTEVILLE, NY 13066

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