Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18161778
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Filing Dt:
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01/30/2023
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Publication #:
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Pub Dt:
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04/11/2024
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Inventors:
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Yun-Chung Wu, Fu Wei Liu, Szu-Hsien Lee, Pei-Wei Lee, Jhao-Yi Wang
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Title:
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SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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05/04/2024 05:17 AM
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