Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18011744
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Filing Dt:
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12/20/2022
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Publication #:
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Pub Dt:
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04/11/2024
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Inventors:
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Jeong Keun LEE, Ju Hyun SUN, Kwan Ho RYU, Min Woo LEE, Tae Keun PARK, Lee Cheol JI et al
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Title:
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WATER-COOLED HEAT DISSIPATION MODULE ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16 HAEBONG-RO 255BEON-GIL, DANWON-GU |
| ANSAN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 15420 |
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| BRIDGEWAY IP LAW GROUP, PLLC |
| 11350 RANDOM HILLS RD., SUITE 800 |
| FAIRFAX, VA 22030 |
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05/11/2024 09:49 AM
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