Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18530286
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Filing Dt:
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12/06/2023
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Publication #:
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Pub Dt:
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04/18/2024
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Inventors:
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Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
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Title:
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SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND METHODS OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN 6 ROAD |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN ROC 30077 |
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| THE MARBURY LAW GROUP, PLLC |
| 11800 SUNRISE VALLEY DRIVE |
| 15TH FLOOR |
| RESTON, VA 20191 |
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