Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18381861
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Filing Dt:
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10/19/2023
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Publication #:
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Pub Dt:
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04/25/2024
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Inventors:
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Raymond J. Recchia, Brian J. Schiermeier, Seyed Hesamoddin Tabatabaei et al
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Title:
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MULTIWALL PAPER-BASED PACKAGING STRUCTURES
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 6026 |
| IL1-1145/54/63 |
| CHICAGO, ILLINOIS 60680-6026 |
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| GAYLE D GROCKE |
| 330 N. WABASH AVENUE |
| SUITE 2800 |
| CHICAGO, IL 60611 |
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Assignment:
2
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SECOND LIEN PATENT SECURITY AGREEMENT
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| 425 WALNUT STREET |
| CINCINNATI, OHIO 45202 |
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| JAVIER J. RAMOS |
| 1850 K STREET, NW |
| SUITE 1100 |
| WASHINGTON, DC 20006 |
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06/03/2024 04:51 PM
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