Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/07/2024
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Application #:
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18155048
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Filing Dt:
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01/16/2023
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Publication #:
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Pub Dt:
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04/25/2024
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Inventors:
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Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
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Title:
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PACKET SORTING AND REASSEMBLY CIRCUIT MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 200, CHUNG PEI RD., CHUNG-LI DIST., |
| TAOYUAN CITY, TAIWAN 32023 |
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| 3F., NO. 698, MINGSHUI RD., ZHONGSHAN DIST., |
| TAIPEI CITY, TAIWAN 104 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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05/29/2024 03:25 AM
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