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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18475356
Filing Dt:
09/27/2023
Publication #:
Pub Dt:
04/25/2024
Inventors:
Hou-Sheng HUANG, Chien-Lung SHEN, Shu-Chu TSAI, Hung-Yu LIN
Title:
ELECTROTHERMAL MODULE
Assignment: 1
Reel/Frame:
065041/0936Recorded: 09/27/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/12/2022
Exec Dt:
09/12/2022
Exec Dt:
09/12/2022
Exec Dt:
09/12/2022
Assignee:
NO.6, CHEN-TIAN RD., TU-CHEN DIST.
NEW TAIPEI CITY, TAIWAN
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
280 INTERSTATE NORTH CIRCLE
SUITE 530
ATLANTA, GA 30339

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