Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18497977
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Filing Dt:
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10/30/2023
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Publication #:
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Pub Dt:
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05/02/2024
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Inventor:
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Cheng Yang
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Title:
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SEMICONDUCTOR PACKAGE INJECTION MOLDING MOLD, INJECTION MOLDING DEVICE AND SEMICONDUCTOR PACKAGE INJECTION MOLDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ROOM 111, BUILDING 1, NO. 200 JICHUANG ROAD, CHINA (SHANGHAI) PILOT FREE TRADE ZONE |
SHANGHAI CITY, CHINA 201208 |
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JCIPRNET |
8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
TAIPEI, 100404 TAIWAN |
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06/10/2024 08:29 AM
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