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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17978465
Filing Dt:
11/01/2022
Publication #:
Pub Dt:
05/02/2024
Inventors:
Ruilong Xie, Julien Frougier, Kangguo Cheng
Title:
DEEP VIA WITH INTERNAL VOID FOR STRESS MITIGATION
Assignment: 1
Reel/Frame:
061613/0489Recorded: 11/01/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/31/2022
Exec Dt:
11/01/2022
Exec Dt:
11/01/2022
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
INTERNATIONAL BUSINESS MACHINES CORPORATION
1701 NORTH STREET
B/256-3
ENDICOTT, NY 13760

Search Results as of: 10/31/2024 07:43 PM
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