Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17978465
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Filing Dt:
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11/01/2022
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Publication #:
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Pub Dt:
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05/02/2024
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Inventors:
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Ruilong Xie, Julien Frougier, Kangguo Cheng
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Title:
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DEEP VIA WITH INTERNAL VOID FOR STRESS MITIGATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 1701 NORTH STREET |
| B/256-3 |
| ENDICOTT, NY 13760 |
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05/31/2024 09:57 PM
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