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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18497409
Filing Dt:
10/30/2023
Publication #:
20240162296
Pub Dt:
05/16/2024
Inventors:
Daniel Maurer, Sabine Konrad, Steffen Sack, Thomas Ostermann
Title:
SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
066704/0986Recorded: 03/08/2024Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MAURER, DANIEL
Exec Dt:
10/29/2023
KONRAD, SABINE
Exec Dt:
11/20/2023
SACK, STEFFEN SACK
Exec Dt:
02/29/2024
OSTERMANN, THOMAS
Exec Dt:
11/28/2023
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
CHRISTINA CIABURRI
PO BOX 1959
CARY, NC 27572-1959
Assignment: 2
Reel/Frame:
066803/0577Recorded: 03/13/2024Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 66704 FRAME: 986. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
Assignors:
MAURER, DANIEL
Exec Dt:
10/29/2023
KONRAD, SABINE
Exec Dt:
11/20/2023
SACK, STEFFEN
Exec Dt:
02/29/2024
OSTERMANN, THOMAS
Exec Dt:
11/28/2023
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
CHRISTINA CIABURRI
PO BOX 1959
CARY, NC 27572-1959

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