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Patent Assignment Details
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Reel/Frame:003914/0054   Pages: 1
Recorded: 08/26/1981
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
07/26/1983
Application #:
06296523
Filing Dt:
08/26/1981
Title:
ELECTROCONDUCTIVE RESIN COMPOSITE MATERIAL FOR MOLDING
Assignors
1
Exec Dt:
08/19/1981
2
Exec Dt:
08/19/1981
Assignee
1
9-11 HORIDOME-CHO 1-CHOME, NIHONBASHI, CHUO-KU
TOKYO, JAPAN
Correspondence name and address
FINNEGAN, HENDERSON, FARABOW, GARRETT &
DUNNER
1775 K ST., N.W.
WASHINGTON, DC 20006

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