Patent Assignment Details
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Reel/Frame: | 003924/0416 | |
| Pages: | 2 |
| | Recorded: | 09/15/1981 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/16/1985
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Application #:
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06302351
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Filing Dt:
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09/15/1981
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Title:
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HIGH VOLTAGE INTEGRATED SEMICONDUCTOR DEVICES USING A THERMOPLASTIC RESIN LAYER
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Assignees
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7-1, TORANOMON 1-CHOME, MINATO-KU |
TOKYO, JAPAN |
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UCHISAWWAI-CHO, 1-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK
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1750 PA. AVENUE,N.W., STE. 1100
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WASHINGTON, DC 20006
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