Patent Assignment Details
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| Reel/Frame: | 004529/0804 | |
| Pages: | 2 |
| | Recorded: | 03/10/1986 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/18/1987
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Application #:
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06838065
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Filing Dt:
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03/10/1986
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Title:
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MULTILAYERED INTERPOSER BOARD FOR POWERING HIGH CURRENT CHIP MODULES
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Correspondence name and address
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ROBERT J. HAASE
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IBM CORP., DEPT., 901/BLDG. 300-482
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HOPEWELL JUNCTION, NY 12533-9988
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