Patent Assignment Details
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| Reel/Frame: | 004566/0874 | |
| Pages: | 1 |
| | Recorded: | 05/16/1986 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/19/1988
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Application #:
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06863882
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Filing Dt:
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05/16/1986
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Title:
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EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR
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Assignee
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| 4-2, YURAKU-CHO, 1-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN |
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Correspondence name and address
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KEIL & WEINKAUF
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1101 CONNECTICUT AVE., N. W.
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WASHINGTON, DC 20036
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