Patent Assignment Details
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| Reel/Frame: | 004858/0132 | |
| Pages: | 1 |
| | Recorded: | 04/13/1988 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/1989
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Application #:
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07156571
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Filing Dt:
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02/17/1988
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Title:
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PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICE
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Assignee
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| 2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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STE. 520, 655 FIFTEENTH ST., N. W.
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WASHINGTON, DC 20005
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