Patent Assignment Details
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| Reel/Frame: | 004893/0691 | |
| Pages: | 1 |
| | Recorded: | 06/11/1988 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/03/1989
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Application #:
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07175182
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Filing Dt:
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03/30/1988
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Title:
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METHOD OF BONDING A SEMICONDUCTOR TO A PACKAGE WITH A LOW AND HIGH VISCOSITY BONDING AGENT
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Assignee
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| 1-3-1, KASUMIGASEKI, CHIYODA-KU |
| TOKYO 100, JAPAN |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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STE 520
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655 FIFTEENTH STREET, N.W.
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WASHINGTON, DC 20005
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