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Reel/Frame:004902/0037   Pages: 1
Recorded: 06/10/1988
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
12/26/1989
Application #:
07184775
Filing Dt:
04/22/1988
Title:
PACKAGE FOR MOUNTING A SEMICONDUCTOR CHIP OF ULTRA-HIGH FREQUENCY
Assignors
1
Exec Dt:
05/02/1988
2
Exec Dt:
05/02/1988
3
Exec Dt:
05/02/1988
Assignee
1
711, AZA SHARIDEN
OAZA KURITA, NAGANO-SHI, NAGANO, JAPAN
Correspondence name and address
STAAS & HALSEY
1825 K STREET, N.W.
WASHINGTON, DC 20006

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