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Patent Assignment Details
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Reel/Frame:004930/0230   Pages: 1
Recorded: 08/03/1988
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
02/12/1991
Application #:
07202296
Filing Dt:
06/06/1988
Title:
THIN-FILM CHIP-TO-SUBSTRATE INTERCONNECT AND METHODS FOR MAKING SAME
Assignor
1
Exec Dt:
06/03/1988
Assignee
1
Correspondence name and address
RICHARD E. CONSTANT
AGC PATENTS, MAIL CODE GC-42
(FOSTL) MS-6F-067, DOE
1000 INDEPENDENCE AVE., SW
WASHINGTON, DC 20585

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