Patent Assignment Details
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| Reel/Frame: | 004987/0822 | |
| Pages: | 1 |
| | Recorded: | 11/14/1988 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/18/1991
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Application #:
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07272136
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Filing Dt:
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11/14/1988
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Title:
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BONDING STRUCTURE OF AN ELECTRONIC DEVICE AND A METHOD FOR MANUFACTURING THE SAME
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Assignee
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| 6-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & WOODWARD, P.C
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261 MADISON AVE.
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NEW YORK, NY 10016
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