Patent Assignment Details
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| Reel/Frame: | 005107/0170 | |
| Pages: | 2 |
| | Recorded: | 08/04/1989 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/29/1990
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Application #:
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07389451
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Filing Dt:
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08/04/1989
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Title:
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PROCESS FOR THE SEPARATION OF MONOLITHIC LED CHIP ARRANGEMENTS GENERATED ON A SEMICONDUCTOR SUBSTRATE WAFER
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Assignee
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| BERLIN AND MUNICH, GERMANY |
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Correspondence name and address
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SIEMENS CORPORATION
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INTELLECTUAL PROPERTY DEPARTMENT
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186 WOOD AVENUE SOUTH
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ISELIN, NJ 08830
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