Patent Assignment Details
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| Reel/Frame: | 005188/0707 | |
| Pages: | 2 |
| | Recorded: | 10/27/1989 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/16/1990
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Application #:
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07411865
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Filing Dt:
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09/25/1989
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Title:
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METHOD FOR BUBBLE-FREE BONDING OF SILICON WAFERS
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Correspondence name and address
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RICHARD E. JENKINS
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200 SOUTH SQUARE CORPORATE CENTRE II
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3708 MAYFAIR STREET
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DURHAM, NC 27707
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