Patent Assignment Details
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| Reel/Frame: | 005214/0223 | |
| Pages: | 1 |
| | Recorded: | 01/16/1990 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/30/1990
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Application #:
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07385879
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Filing Dt:
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07/27/1989
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Title:
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WAFER HAVING A DICING AREA HAVING A STEP REGION COVERED WITH A CONDUCTIVE LAYER AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 2-3 MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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STEPHEN A. BECKER
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99 CANAL CENTER PLAZA
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ALEXANDRIA, VA 22314
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