Patent Assignment Details
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| Reel/Frame: | 005273/0643 | |
| Pages: | 2 |
| | Recorded: | 03/30/1990 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/05/1991
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Application #:
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07502090
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Filing Dt:
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03/30/1990
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Title:
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SOLDER/POLYMER COMPOSITE PASTE AND METHOD
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Correspondence name and address
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PHILIP J. FEIG
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INTELLECTUAL PROPERTY LAW DEPT.
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IBM CORP. - P. O. BOX 218
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YORKTOWN HEIGHTS, NY 10598
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