Patent Assignment Details
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| Reel/Frame: | 005306/0666 | |
| Pages: | 2 |
| | Recorded: | 05/03/1990 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/07/1992
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Application #:
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07518509
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Filing Dt:
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05/03/1990
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Title:
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METHOD OF TREATING WAFER SURFACE
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Assignee
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| 1-1 TENJINKITAMACHI, TERANOUCHI-AGARU 4-CHOME, HORIKAWA-DORI, KAMIKYO-KU, |
| KYOTO, JAPAN 602 |
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Correspondence name and address
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OSTROLENK, FABER, GERB & SOFFEN
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1180 AVENUE OF THE AMERICAS
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NEW YORK, NY 10036-8403
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