Patent Assignment Details
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Reel/Frame: | 005311/0204 | |
| Pages: | 4 |
| | Recorded: | 05/14/1990 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/04/1991
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Application #:
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07483977
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Filing Dt:
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02/20/1990
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Title:
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IMPROVED DIE-MOUNTING PADDLE FOR MECHANICAL STRESS REDUCTION IN PLASTIC IC PACKAGES
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Assignee
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2805 E. COLUMBIA ROAD, A CORP. OF DE |
BOISE, IDAHO 83706 |
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Correspondence name and address
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JON PAUL BUSACK
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MICRON TECHNOLOGY, INC.
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LEGAL DEPARTMENT
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2805 E. COLUMBIA ROAD
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BOISE, ID 83706
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