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Patent Assignment Details
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Reel/Frame:005316/0311   Pages: 2
Recorded: 05/17/1990
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
02/25/1992
Application #:
07524434
Filing Dt:
05/17/1990
Title:
METHOD OF SEALING SEMICONDUCTOR DEVICE WITH RESIN BY PRESSING A LEAD FRAME TO A HEAT SINK USING AN UPPER MOLD PRESSURE MEMBER
Assignors
1
Exec Dt:
05/10/1990
2
Exec Dt:
05/10/1990
3
Exec Dt:
05/10/1990
Assignee
1
72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI
KANAGAWA-KEN, JAPAN
Correspondence name and address
FOLEY & LARDNER, SCHWARTZ, JEFFERY,
SCHWAAB, MACK, BLUMENTHAL & EVANS
P. O. BOX 299
ALEXANDRIA, VA 22313-0299

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