Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 005394/0667 | |
| Pages: | 2 |
| | Recorded: | 07/25/1990 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/10/1991
|
Application #:
|
07557070
|
Filing Dt:
|
07/25/1990
|
Title:
|
METHOD FOR PREPARING A SUBSTRATE FOR FORMING SEMICONDUCTOR DEVICES BY BONDING WARPED WAFERS
|
|
Assignee
|
|
|
4-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
|
Correspondence name and address
|
|
SQUIRE, SANDERS & DEMPSEY
|
|
1201 PENNSYLVANIA AVE., N.W.
|
|
P.O. BOX 407
|
|
WASHINGTON, DC 20044
|
Search Results as of:
05/01/2024 08:40 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|