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Patent Assignment Details
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Reel/Frame:005420/0804   Pages: 2
Recorded: 08/23/1990
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
03/24/1992
Application #:
07538334
Filing Dt:
06/15/1990
Title:
ALUMINA MULTILAYER WIRING SUBSTRATE PROVIDED WITH HIGH DIELECTRIC MATERIAL LAYER
Assignors
1
Exec Dt:
07/24/1990
2
Exec Dt:
07/24/1990
3
Exec Dt:
08/03/1990
4
Exec Dt:
08/02/1990
5
Exec Dt:
08/03/1990
Assignees
1
NO. 14-18, TAKATSUJI-CHO, MIZUHO-KU, NAGOYA-SHI, A CORP. OF JAPAN
AICHI, JAPAN
2
20000, MARINER AVE., STE. 450, A CORP. OF JAPAN
TORRANCE, CALIFORNIA 90503
3
145, S. 79TH ST. A CORP. OF JAPAN
CHANDLER, ARIZONA 85226
Correspondence name and address
FINNEGAN, HENDERSON, FARABOW,
GARRETT & DUNNER
1300 I ST, NW
WASHINGTON, DC 20005-3315

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