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Patent Assignment Details
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Reel/Frame:005443/0352   Pages: 2
Recorded: 09/25/1989
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
12/24/1991
Application #:
07394095
Filing Dt:
08/15/1989
Title:
MOLDING MATERIAL FOR ELECTROCONDUCTIVE IC PARTS
Assignors
1
Exec Dt:
09/18/1989
2
Exec Dt:
09/18/1989
3
Exec Dt:
09/18/1989
4
Exec Dt:
09/18/1989
5
Exec Dt:
09/18/1989
6
Exec Dt:
09/18/1989
Assignee
1
JAPAN
Correspondence name and address
STUART J. FRIEDMAN
SIXBEY, FRIEDMAN, LEEDOM & FERGUSON, PC
SUITE 600
2010 CORPORATE RIDGE
MCLEAN, VA 22102

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