Patent Assignment Details
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| Reel/Frame: | 005496/0374 | |
| Pages: | 2 |
| | Recorded: | 11/01/1990 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/31/1991
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Application #:
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07583813
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Filing Dt:
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09/17/1990
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Title:
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METHOD OF ENCAPSULATING A SEMICONDUCTOR ELEMENT USING A RESIN MOLD HAVING UPPER AND LOWER MOLD HALF RESIN INFLOW OPENINGS
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Assignee
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| 4-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO-TO, JAPAN |
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Correspondence name and address
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THOMAS SCHNECK
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P.O. BOX 2-E
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111 WEST ST. JOHN STREET
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SUITE 620
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SAN JOSE, CA 95109-0005
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