Patent Assignment Details
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| Reel/Frame: | 005519/0977 | |
| Pages: | 3 |
| | Recorded: | 11/26/1990 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/02/1992
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Application #:
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07618031
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Filing Dt:
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11/26/1990
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Title:
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METHOD OF FORMING A SOLDER LAYER ON PADS OF A CIRCUIT BOARD AND METHOD OF MOUNTING AN ELECTRONIC PART ON A CIRCUIT BOARD
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Assignees
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| 6-1, 2-CHOME, MARUNOUCHI, CHIYODA-KU, |
| TOKYO,, JAPAN |
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| 671-4, MIZUASHI, NOGUCHI-CHO, KAKOGAWA, |
| HYOGO,, JAPAN 675 |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & WOODWARD
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600 THIRD AVE., 30TH FLOOR
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NEW YORK, NY 10016
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