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Patent Assignment Details
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Reel/Frame:005529/0841   Pages: 2
Recorded: 12/14/1990
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
05/21/1991
Application #:
07331809
Filing Dt:
04/03/1989
Title:
METHOD OF FABRICATING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES INCLUDING UPDIFFUSION TO SELECTIVELY DOPE A SILICON LAYER
Assignor
1
Exec Dt:
03/16/1990
Assignee
1
TOKYO, JAPAN 100
Correspondence name and address
ANTONELLI, TERRY & WANDS
SUITE 600
1919 PENN AVE., N. W.
WASHINGTON, DC 20006

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